Global Copper Foil Market Size 2022-27 Share, Research, Industry Growth, Report, Price Trends 2027 | IMARC Group
The global copper foil market reached a value of US$5.24 billion in 2021. Looking ahead, IMARC Group expects the market to reach a value of US$8.09 billion. by 2027, growing at a CAGR of 7.10% in 2022-2027.
Copper foil is a thin sheet of copper made by the process of electroplating or rolling copper foil. Compared to aluminum foil, it offers improved flexibility and resistance to heat and heat. As a result, copper foil is widely used as an electrical conductor for circuit boards, batteries, and solar-powered devices. It is also used in printed circuit boards (PCBs) that are incorporated into telecommunications devices, such as personal computers (PCs), tablets, and mobile phones.
Base year: 2021
Forecast year: 2022-2027
Copper Foil Market Trends and Drivers:
The market is mainly driven by the increase in sales of electronic devices. In addition, the improvement of 5G infrastructure due to the growing need for better connection solutions represents another major growth factor.
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Furthermore, the market is further propelled by the growing demand for electric vehicles (EVs) due to rising greenhouse gas (GHG) emissions globally. Additionally, several key players are increasing product differentiation by improving the surface properties of copper foil and developing new surface treatment coatings to expand their consumer base.
This, coupled with the increasing applications of copper sheets in decorative materials, such as monasteries, gold signs, tile mosaics, and handicrafts, is also creating a positive market outlook across the globe.
Note: We regularly track the direct effect of COVID-19 on the market, as well as the indirect influence of associated industries. These observations will be incorporated into the report.
Analysis and segmentation of the global copper foil market 2022-2027:
The competitive landscape of the market has been studied in the report with the detailed profiles of the major players operating in the market.
Carl Schlenk AG, Chang Chun Group, Furukawa Electric Co. Ltd., ILJIN Materials Co. Ltd., JX Nippon Mining & Metals Corporation (ENEOS Holdings Inc.), LS Mtron Co. Ltd., Mitsui Mining & Smelting Co. Ltd. , Nippon Denkai Ltd., Rogers Corporation, SKC Co. Ltd., Sumitomo Metal Mining Co. Ltd., Targray Technology International Inc. and UACJ Corporation.
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The report has segmented the market based on region, product type, application, and end-use industry.
Breakdown by product type:
• rolled copper foil
• Electroplated copper foil
Breakdown by application:
• Circuit boards
• Electromagnetic shielding
Breakdown by end-use industry:
• Aeronautics and Defense
• Building and construction
• Electrical and Electronic
• industrial equipment
Breakdown by region:
• North America: (United States, Canada)
• Asia-Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
• Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
• Latin America: (Brazil, Mexico, Others)
• Middle East and Africa
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Main highlights of the report:
• Market Performance (2016-2021)
• Market Outlook (2022-2027)
• Porter’s Five Forces Analysis
• Market drivers and success factors
• SWOT analysis
• Value chain
• Complete mapping of the competitive landscape
If you need specific information that is not currently covered in the report, we can provide it to you as part of the customization.
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